Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10511075 | Integrated fan-out package including dielectric waveguide | Chewn-Pu Jou | 2019-12-17 |
| 10475732 | 3DIC package integration for high-frequency RF system | — | 2019-11-12 |
| 10468345 | 3D IC decoupling capacitor structure and method for manufacturing the same | Chewn-Pu Jou | 2019-11-05 |
| 10460987 | Semiconductor package device with integrated antenna and manufacturing method thereof | Feng-Wei Kuo, Chih-Hang Tung, Chen-Hua Yu | 2019-10-29 |
| 10411328 | Patch antenna structures and methods | Feng-Wei Kuo | 2019-09-10 |
| 10319690 | Semiconductor structure and manufacturing method thereof | Chewn-Pu Jou, Chih-Hang Tung, Chen-Hua Yu | 2019-06-11 |
| 10297657 | Magnetic core inductors for integrated voltage regulator | — | 2019-05-21 |
| 10283443 | Chip package having integrated capacitor | Chewn-Pu Jou | 2019-05-07 |
| 10276518 | Semiconductor arrangement in fan out packaging including magnetic structure around transmission line | Huan-Neng Chen | 2019-04-30 |
| 10269691 | Method of forming semiconductor structure | Chewn-Pu Jou | 2019-04-23 |