CJ

Chewn-Pu Jou

TSMC: 20 patents #34 of 3,065Top 2%
Overall (2019): #2,073 of 560,194Top 1%
20
Patents 2019

Issued Patents 2019

Showing 1–20 of 20 patents

Patent #TitleCo-InventorsDate
10511075 Integrated fan-out package including dielectric waveguide Wen-Shiang Liao 2019-12-17
10510827 Capacitor having multiple graphene structures Chih-Hsin Ko, Po-Wen Chiu, Chao-Ching Cheng, Chun-Chieh Lu, Chi-Feng Huang +3 more 2019-12-17
10468345 3D IC decoupling capacitor structure and method for manufacturing the same Wen-Shiang Liao 2019-11-05
10453809 RF switch on high resistive substrate Chia-Chung Chen, Chi-Feng Huang, Shu Fang Fu, Tzu-Jin Yeh 2019-10-22
10447328 Systems and methods for die-to-die communication Huan-Neng Chen, Feng-Wei Kuo, Lan-Chou Cho, William Wu Shen 2019-10-15
10379156 Bump ball testing system and method Min-Jer Wang 2019-08-13
10326491 Transceiving device Feng-Wei Kuo, Huan-Neng Chen, Lan-Chou Cho, Robert Bogdan Staszewski, Masoud Babaie 2019-06-18
10326584 Carrier synchronization device Huan-Neng Chen, William Wu Shen, Lan-Chou Cho, Feng-Wei Kuo 2019-06-18
10326454 All-digital phase locked loop using switched capacitor voltage doubler Feng-Wei Kuo, Huan-Neng Chen, Lan-Chou Cho, Robert Bogdan Staszewski, Seyednaser Pourmousavian 2019-06-18
10319690 Semiconductor structure and manufacturing method thereof Wen-Shiang Liao, Chih-Hang Tung, Chen-Hua Yu 2019-06-11
10298277 Channel loss compensation circuits Lan-Chou Cho, Feng-Wei Kuo, Huan-Neng Chen, William Wu Shen 2019-05-21
10291272 Communication system and method of data communications Feng-Wei Kuo, William Wu Shen, Huan-Neng Chen, Lan-Chou Cho 2019-05-14
10290740 Semiconductor device with reduced parasitic capacitance 2019-05-14
10283443 Chip package having integrated capacitor Wen-Shiang Liao 2019-05-07
10269691 Method of forming semiconductor structure Wen-Shiang Liao 2019-04-23
10270486 Ultra-low power receiver Feng-Wei Kuo, Huan-Neng Chen, Lan-Chou Cho, Robert Bogdan Staszewski, Sandro Binsfeld Ferreira 2019-04-23
10270389 Semiconductor device and method Lan-Chou Cho, Huan-Neng Chen, Feng-Wei Kuo 2019-04-23
10211202 Method of forming bandgap reference integrated circuit Chien-Jung Wang 2019-02-19
10192833 Interposer and semiconductor package with noise suppression features Feng-Wei Kuo, Hui Yu Lee, Huan-Neng Chen, Yen-Jen Chen, Yu-Ling Lin 2019-01-29
10171089 PVT-free calibration function using a doubler circuit for TDC resolution in ADPLL applications Feng-Wei Kuo, Lan-Chou Cho, Huan-Neng Chen, Robert Bogdan Staszewski, Seyednaser Pourmousavian 2019-01-01