Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10192833 | Interposer and semiconductor package with noise suppression features | Feng-Wei Kuo, Hui Yu Lee, Huan-Neng Chen, Yu-Ling Lin, Chewn-Pu Jou | 2019-01-29 |
YC
Yen-Jen Chen
Overall (2019): #214,726 of 560,194Top 40%
1
Patents 2019