Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354986 | Hollow metal pillar packaging scheme | Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai | 2019-07-16 |
| 10269737 | Method for manufacturing semiconductor structure | Hsien-Ming Tu, Ching-Jung Yang, Shih-Wei Liang, Hung-Yi Kuo, Yu-Chia Lai +3 more | 2019-04-23 |
| 10262958 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Yu-Chia Lai, Tung-Liang Shao | 2019-04-16 |