Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522437 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Ching-Feng Yang | 2019-12-31 |
| 10510689 | Solder ball protection in packages | Chia-Chun Miao, Kai-Chiang Wu | 2019-12-17 |
| 10497646 | Dual-mode wireless charging device | Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng, Hsien-Ming Tu | 2019-12-03 |
| 10347563 | Barrier structures between external electrical connectors | Chia-Chun Miao, Kai-Chiang Wu | 2019-07-09 |
| 10312209 | Manufacturing method of semiconductor package | Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Yen-Ping Wang | 2019-06-04 |
| 10269588 | Integrated circuit underfill scheme | Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao +1 more | 2019-04-23 |
| 10269737 | Method for manufacturing semiconductor structure | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Hung-Yi Kuo, Yu-Chia Lai +3 more | 2019-04-23 |