Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522437 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang | 2019-12-31 |
| 10510681 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2019-12-17 |
| 10312209 | Manufacturing method of semiconductor package | Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Shih-Wei Liang | 2019-06-04 |
| 10276404 | Integrated fan-out package | Kai-Chiang Wu, Chung-Hao Tsai, Chun-Lin Lu, Che-Wei Hsu | 2019-04-30 |
| 10269640 | Method for singulating packaged integrated circuits and resulting structures | Ming-Kai Liu, Kai-Chiang Wu | 2019-04-23 |
| 10269588 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu +1 more | 2019-04-23 |
| 10170444 | Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Ching-Jung Yang | 2019-01-01 |