Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510681 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2019-12-17 |
| 10504865 | Package structure and method of manufacturing the same | Han-Ping Pu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh | 2019-12-10 |
| 10312209 | Manufacturing method of semiconductor package | Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Shih-Wei Liang, Yen-Ping Wang | 2019-06-04 |
| 10304790 | Method of fabricating an integrated fan-out package | Shou-Zen Chang, Chung-Hao Tsai, Chuei-Tang Wang, Kai-Chiang Wu | 2019-05-28 |
| 10269588 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Chia-Chun Miao +1 more | 2019-04-23 |
| 10269640 | Method for singulating packaged integrated circuits and resulting structures | Yen-Ping Wang, Kai-Chiang Wu | 2019-04-23 |