Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510693 | Semiconductor package structure | Kai-Chiang Wu, Chun-Lin Lu, Chao-Wen Shih, Nan-Chin Chuang | 2019-12-17 |
| 10504865 | Package structure and method of manufacturing the same | Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh | 2019-12-10 |
| 10490479 | Packaging of semiconductor device with antenna and heat spreader | Albert Wan, Chao-Wen Shih, Hsin-Yu Pan, Sen-Kuei Hsu | 2019-11-26 |
| 10381309 | Package structure having connecting module | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Chun-Lin Lu, Chao-Wen Shih +2 more | 2019-08-13 |
| 10366971 | Pre-applying supporting materials between bonded package components | Yu-Chen Hsu, Yu-Feng Chen, Meng-Tse Chen, Guan-Yu Chen | 2019-07-30 |
| 10366966 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2019-07-30 |
| 10269720 | Integrated fan-out packaging | Hsiao-Wen Lee | 2019-04-23 |
| 10256203 | Semiconductor device and semiconductor package | Lipu Kris Chuang, Hsin-Yu Pan, Sen-Kuei Hsu | 2019-04-09 |