Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10436818 | Probe module having cantilever MEMS probe and method of making the same | Yu-Wen Wang, Horng-Kuang Fan, Mao-Fa Shen | 2019-10-08 |
| 10366971 | Pre-applying supporting materials between bonded package components | Yu-Feng Chen, Han-Ping Pu, Meng-Tse Chen, Guan-Yu Chen | 2019-07-30 |
| 10290919 | Electronic device | Ching-Pin Hsu, Chien-An Chou | 2019-05-14 |