Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366971 | Pre-applying supporting materials between bonded package components | Yu-Chen Hsu, Yu-Feng Chen, Han-Ping Pu, Meng-Tse Chen | 2019-07-30 |
| 10170827 | Housing structure having conductive adhesive antenna and conductive adhesive antenna thereof | — | 2019-01-01 |