HP

Hsin-Yu Pan

TSMC: 3 patents #707 of 3,065Top 25%
Overall (2019): #87,750 of 560,194Top 20%
3
Patents 2019

Issued Patents 2019

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
10510713 Semicondcutor package and method of manufacturing the same Shih-Wei Chen, Chih-Hua Chen, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo 2019-12-17
10490479 Packaging of semiconductor device with antenna and heat spreader Albert Wan, Chao-Wen Shih, Han-Ping Pu, Sen-Kuei Hsu 2019-11-26
10256203 Semiconductor device and semiconductor package Lipu Kris Chuang, Han-Ping Pu, Sen-Kuei Hsu 2019-04-09