Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490479 | Packaging of semiconductor device with antenna and heat spreader | Albert Wan, Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan | 2019-11-26 |
| 10274518 | Devices for high-density probing techniques and method of implementing the same | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Wei-Hsun Lin, De-Jian Liu | 2019-04-30 |
| 10256203 | Semiconductor device and semiconductor package | Lipu Kris Chuang, Han-Ping Pu, Hsin-Yu Pan | 2019-04-09 |