Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490479 | Packaging of semiconductor device with antenna and heat spreader | Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan, Sen-Kuei Hsu | 2019-11-26 |
| 10475757 | Package structure and manufacturing method thereof | Chao-Wen Shih, Shou-Zen Chang, Nan-Chin Chuang | 2019-11-12 |
| 10461166 | Electrical contact | Christian Albertus Nijhuis, Li Jiang, Suchand Sangeeth Chandramathi Sukumaran | 2019-10-29 |
| 10381309 | Package structure having connecting module | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Chun-Lin Lu, Chao-Wen Shih +2 more | 2019-08-13 |
| 10366966 | Method of manufacturing integrated fan-out package | Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu +5 more | 2019-07-30 |
| 10183858 | Semiconductor structure and method of manufacturing the same | Yu-Sheng Hsieh, Chao-Wen Shih, Shou-Zen Chang, Chung-Shi Liu, Chen-Hua Yu | 2019-01-22 |
| 10186492 | Package structure and manufacturing method thereof | Chao-Wen Shih, Shou-Zen Chang, Nan-Chin Chuang | 2019-01-22 |