Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510635 | Integrated circuit packages and methods for forming the same | Hsien-Wei Chen, Tsung-Fu Tsai, Wen-Hsiung Lu, Yian-Liang Kuo | 2019-12-17 |
| 10495687 | Reliability testing method | Shiang-Ruei Su, Liang-Chen Lin | 2019-12-03 |
| 10453818 | Packaging structures of integrated circuits | Tsung-Fu Tsai, Yian-Liang Kuo, Ru-Ying Huang | 2019-10-22 |
| 10340258 | Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices | Yian-Liang Kuo, Yi Wang | 2019-07-02 |
| 10276496 | Plurality of different size metal layers for a pad structure | Hsien-Wei Chen, Ching-Jung Yang | 2019-04-30 |
| 10269750 | Methods and apparatus of packaging semiconductor devices | Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2019-04-23 |