Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510635 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Tsung-Fu Tsai, Wen-Hsiung Lu | 2019-12-17 |
| 10453818 | Packaging structures of integrated circuits | Tsung-Fu Tsai, Chia-Wei Tu, Ru-Ying Huang | 2019-10-22 |
| 10340258 | Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices | Chia-Wei Tu, Yi Wang | 2019-07-02 |
| 10269750 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2019-04-23 |