Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453818 | Packaging structures of integrated circuits | Tsung-Fu Tsai, Chia-Wei Tu, Yian-Liang Kuo | 2019-10-22 |
| 10269750 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ming-Song Sheu, Hsien-Wei Chen | 2019-04-23 |