| 10462433 |
Image sensor with big and small pixels and method of manufacture |
Gang Chen, Dyson H. Tai |
2019-10-29 |
| 10418408 |
Curved image sensor using thermal plastic substrate material |
Yuanwei Zheng, Chia-Chun Miao, Gang Chen, Yin Qian, Dyson H. Tai +1 more |
2019-09-17 |
| 10411063 |
Single-exposure high dynamic range sensor |
Dajiang Yang, Oray Orkun Cellek, Xianfu Cheng, Xin Wang, Bill Phan +1 more |
2019-09-10 |
| 10334191 |
Pixel array with embedded split pixels for high dynamic range imaging |
Dajiang Yang, Zhiyong Zhan, Chen Lu, Xin Wang, Keiji Mabuchi |
2019-06-25 |
| 10312391 |
Apparatus and method for single-photon avalanche-photodiode detectors with reduced dark count rate |
Gang Chen, Vincent Venezia, Dyson H. Tai, Bowei Zhang |
2019-06-04 |
| 10304891 |
Backside metal grid and metal pad simplification |
Qin Wang, Gang Chen |
2019-05-28 |
| 10290670 |
Resonant-filter image sensor and associated fabrication method |
Yuanwei Zheng, Gang Chen, Dyson H. Tai, Lequn Liu |
2019-05-14 |
| 10269850 |
Biased deep trench isolation |
Yuanwei Zheng, Gang Chen, Dyson H. Tai, Yi Ma |
2019-04-23 |
| 10243015 |
Silicon photosensor array integrated circuit on [110]substrate with deep, anisotropically-etched, trench isolation |
Xin Wang, Dajiang Yang, Siguang Ma, Dyson H. Tai |
2019-03-26 |
| 10218924 |
Low noise CMOS image sensor by stack architecture |
Sohei Manabe, Keiji Mabuchi, Takayuki Goto, Hiroaki Ebihara, Kazufumi Watanabe |
2019-02-26 |
| 10211253 |
Self-alignment of a pad and ground in an image sensor |
Qin Wang, Gang Chen |
2019-02-19 |