Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312203 | Structure and formation method of chip package with antenna element | Yung-Ping Chiang, Nien-Fang Wu, Yi-Che Chiang, Chao-Wen Shih, Shou-Zen Chang +2 more | 2019-06-04 |
| 10276920 | Package structure, electronic device and method of fabricating package structure | Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2019-04-30 |
| 10269904 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Tsung-Yuan Yu +1 more | 2019-04-23 |