Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276525 | Package structure and method of fabricating the same | Ching-Wen Hsiao, Chen-Shien Chen, Mirng-Ji Lii | 2019-04-30 |
| 10276532 | Three-dimensional chip stack and method of forming the same | Wei-Ming Chen, Cheng-Hsien Hsieh, Sung-Hui Huang | 2019-04-30 |
| 10269584 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2019-04-23 |