Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510727 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Shou-Cheng Hu | 2019-12-17 |
| 10490468 | Semiconductor structure with conductive structure | Pei-Chun Tsai, Tin-Hao Kuo, Hao-Yi Tsai | 2019-11-26 |
| 10276509 | Integrated fan-out package | Chih-Hao Chang, Hsin-Hung Liao, Hao-Yi Tsai, Chien Ling Hwang, Tsung-Hsien Chiang +1 more | 2019-04-30 |
| 10177073 | Wafer level embedded heat spreader | Tsung-Hsien Chiang, Yen-Chang Hu, Ching-Wen Hsiao | 2019-01-08 |