Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510712 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2019-12-17 |
| 10504870 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu | 2019-12-10 |
| 10438922 | Method and system for mounting components in semiconductor fabrication process | Chien Ling Hwang, Yu-Ting Chiu, Ching-Hua Hsieh | 2019-10-08 |
| 10276509 | Integrated fan-out package | Chih-Hao Chang, Hao-Yi Tsai, Chien Ling Hwang, Wei Sen Chang, Tsung-Hsien Chiang +1 more | 2019-04-30 |
| 10269582 | Package structure, fan-out package structure and method of the same | Chien Ling Hwang, Yu-Ting Chiu | 2019-04-23 |