Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510712 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin, Chung-Shi Liu | 2019-12-17 |
| 10504870 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Chung-Shi Liu | 2019-12-10 |
| 10276531 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Chien Ling Hwang, Yeong-Jyh Lin, Bor-Ping Jang | 2019-04-30 |