Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10513070 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chung-Shi Liu, Meng-Tse Chen, Ming-Da Cheng +1 more | 2019-12-24 |
| 10510712 | Methods for controlling warpage in packaging | Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2019-12-17 |
| 10504870 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Hsin-Hung Liao, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu | 2019-12-10 |
| 10497619 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Chia-Lin Yu, Hung-Pin Chang, Jui-Pin Hung, Yung-Chi Lin | 2019-12-03 |
| 10461051 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Hung-Jui Kuo, Chung-Shi Liu | 2019-10-29 |
| 10438922 | Method and system for mounting components in semiconductor fabrication process | Hsin-Hung Liao, Yu-Ting Chiu, Ching-Hua Hsieh | 2019-10-08 |
| 10366966 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2019-07-30 |
| 10276531 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Yeong-Jyh Lin, Bor-Ping Jang, Hsiao-Chung Liang | 2019-04-30 |
| 10276509 | Integrated fan-out package | Chih-Hao Chang, Hsin-Hung Liao, Hao-Yi Tsai, Wei Sen Chang, Tsung-Hsien Chiang +1 more | 2019-04-30 |
| 10269582 | Package structure, fan-out package structure and method of the same | Hsin-Hung Liao, Yu-Ting Chiu | 2019-04-23 |