Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10513070 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen, Ming-Da Cheng +1 more | 2019-12-24 |
| 10510712 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Hsin-Hung Liao, Hsiao-Chung Liang, Chung-Shi Liu | 2019-12-17 |
| 10504870 | Mechanisms for forming bonding structures | Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu | 2019-12-10 |
| 10276531 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang | 2019-04-30 |