Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438922 | Method and system for mounting components in semiconductor fabrication process | Chien Ling Hwang, Hsin-Hung Liao, Ching-Hua Hsieh | 2019-10-08 |
| 10366966 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2019-07-30 |
| 10276885 | Proton exchange membrane and manufacturing method thereof | Fan-Gang Tseng, Pen-Cheng Wang | 2019-04-30 |
| 10269582 | Package structure, fan-out package structure and method of the same | Chien Ling Hwang, Hsin-Hung Liao | 2019-04-23 |