Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10177073 | Wafer level embedded heat spreader | Wei Sen Chang, Tsung-Hsien Chiang, Ching-Wen Hsiao | 2019-01-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10177073 | Wafer level embedded heat spreader | Wei Sen Chang, Tsung-Hsien Chiang, Ching-Wen Hsiao | 2019-01-08 |