Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522444 | Surface treatment method and apparatus for semiconductor packaging | Jie Deng, Tin-Hao Kuo, Ying-Yu Chen | 2019-12-31 |
| 10388622 | Bump structure having a side recess and semiconductor structure including the same | Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin | 2019-08-20 |