Issued Patents 2019
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276548 | Semiconductor packages having dummy connectors and methods of forming same | Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su +2 more | 2019-04-30 |
| 10276528 | Semicondcutor device and manufacturing method thereof | Chin-Yu Ku, Cheng-Lung Yang, Hon-Lin Huang, Chao-Yi Wang, Ching-Hui Chen +1 more | 2019-04-30 |
| 10276481 | Package structure having a plurality of conductive balls having narrow width for the ball waist | Pi-Lan Chang, Chin-Yu Ku, Hsu-Hsien Chen, Wei-Chih Huang, Chun-Ying Lin +1 more | 2019-04-30 |
| 10269703 | Semiconductor device and method of forming the same | Chin-Yu Ku, Sheng-Pin Yang, Hon-Lin Huang, Chien-Chih Chou, Ting-Li Yang | 2019-04-23 |
| 10269759 | Trace design for bump-on-trace (BOT) assembly | Yen-Liang Lin, Tin-Hao Kuo | 2019-04-23 |
| 10269676 | Thermally enhanced package-on-package (PoP) | Tsung-Hsien Chiang, Ming Hung Tseng | 2019-04-23 |
| 10263064 | Semiconductor devices and methods of forming the same | Chin-Yu Ku, Chien-Chih Chou, Hon-Lin Huang, Chi-Cheng Chen, Kuang-Yi Wu | 2019-04-16 |
| 10209049 | Fabrication and monitoring device for micro probe ball tip | Ruijun Li, Zhenying Cheng, Kuangchao Fan | 2019-02-19 |