Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269703 | Semiconductor device and method of forming the same | Chin-Yu Ku, Sheng-Pin Yang, Chen-Shien Chen, Hon-Lin Huang, Chien-Chih Chou | 2019-04-23 |
| 10252363 | Forming a solder joint between metal layers | Toyohiro Aoki, Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Kazushige Toriyama | 2019-04-09 |