YO

Yasumitsu Orii

IBM: 1 patents #5,496 of 11,143Top 50%
Overall (2019): #215,813 of 560,194Top 40%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10252363 Forming a solder joint between metal layers Toyohiro Aoki, Akihiro Horibe, Hiroyuki Mori, Kazushige Toriyama, Ting-Li Yang 2019-04-09