Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424510 | Solder fill into high aspect through holes | Akihiro Horibe, Kuniaki Sueoka, Kazushige Toriyama | 2019-09-24 |
| 10388566 | Solder fill into high aspect through holes | Akihiro Horibe, Kuniaki Sueoka, Kazushige Toriyama | 2019-08-20 |
| 10325839 | Reduction of stress in via structure | Takashi Hisada, Akihiro Horibe, Sayuri Hada, Eiji Nakamura, Kuniaki Sueoka | 2019-06-18 |
| 10252363 | Forming a solder joint between metal layers | Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Kazushige Toriyama, Ting-Li Yang | 2019-04-09 |