Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424510 | Solder fill into high aspect through holes | Toyohiro Aoki, Akihiro Horibe, Kuniaki Sueoka | 2019-09-24 |
| 10388566 | Solder fill into high aspect through holes | Toyohiro Aoki, Akihiro Horibe, Kuniaki Sueoka | 2019-08-20 |
| 10252363 | Forming a solder joint between metal layers | Toyohiro Aoki, Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Ting-Li Yang | 2019-04-09 |