Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431847 | Stacked film battery architecture | Akihiro Horibe | 2019-10-01 |
| 10424510 | Solder fill into high aspect through holes | Toyohiro Aoki, Akihiro Horibe, Kazushige Toriyama | 2019-09-24 |
| 10388566 | Solder fill into high aspect through holes | Toyohiro Aoki, Akihiro Horibe, Kazushige Toriyama | 2019-08-20 |
| 10388578 | Wafer scale testing and initialization of small die chips | Akihiro Horibe, Yasuteru Kohda, Seiji Munetoh, Chitra Subramanian | 2019-08-20 |
| 10325839 | Reduction of stress in via structure | Toyohiro Aoki, Takashi Hisada, Akihiro Horibe, Sayuri Hada, Eiji Nakamura | 2019-06-18 |