Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325839 | Reduction of stress in via structure | Toyohiro Aoki, Takashi Hisada, Akihiro Horibe, Eiji Nakamura, Kuniaki Sueoka | 2019-06-18 |
SH
Sayuri Hada
Overall (2019): #285,490 of 560,194Top 55%
1
Patents 2019