Issued Patents 2019
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522490 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen | 2019-12-31 |
| 10521546 | Optical proximity correction method and system | Jinyin Wan, Jinheng Wang, Lei Zhang | 2019-12-31 |
| 10515922 | Multi-chip integrated fan-out package | Hsien-Wei Chen | 2019-12-24 |
| 10510678 | Eliminate sawing-induced peeling through forming trenches | Hsien-Wei Chen | 2019-12-17 |
| 10510668 | Method of fabricating semiconductor device | Hsien-Wei Chen | 2019-12-17 |
| 10511860 | Signal transforming method and device | Xing Zhu, Yu Lu | 2019-12-17 |
| 10511326 | Systems and methods for decoding error correcting codes | Yuan-Mao Chang, Chung-Li Wang | 2019-12-17 |
| 10504852 | Three-dimensional integrated circuit structures | Hsien-Wei Chen, Ying-Ju Chen | 2019-12-10 |
| 10491244 | Systems and methods for decoding error correcting codes | Yuan-Mao Chang, Chung-Li Wang | 2019-11-26 |
| 10475760 | Semiconductor device | Ying-Ju Chen, Hsien-Wei Chen, Tsung-Yuan Yu | 2019-11-12 |
| 10461060 | Structure and formation method of chip package with redistribution layers | Hsien-Wei Chen | 2019-10-29 |
| 10412855 | Air deflection system | Wei Li, Zhao Zhang, Nan Wang | 2019-09-10 |
| 10366953 | Redistribution layer structures for integrated circuit package | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Ying-Ju Chen | 2019-07-30 |
| 10339146 | Device and method for providing media resource | Xuan Zheng, Bing Ji | 2019-07-02 |
| 10330972 | Transmissive liquid crystal panel and 3D printer | Chen-Cheng Wang | 2019-06-25 |
| 10317047 | Filtering unit and apparatus | — | 2019-06-11 |
| 10287314 | Methods of reducing level of one or more impurities in a sample during protein purification | Nanying Bian, Christopher Gillespie, Matthew T. Stone, Mikhail Kozlov, Martin Siwak | 2019-05-14 |
| 10269749 | Method of forming a semiconductor device with bump stop structure | Hsien-Wei Chen | 2019-04-23 |
| 10269767 | Multi-chip packages with multi-fan-out scheme and methods of manufacturing the same | Hsien-Wei Chen | 2019-04-23 |
| 10269764 | Discrete polymer in fan-out packages | Hsien-Wei Chen | 2019-04-23 |
| 10262957 | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels | Rajen Manicon Murugan, Minhong Mi, Gary P. Morrison, Kenneth Robert Rhyner, Stanley Craig Beddingfield +2 more | 2019-04-16 |
| 10262952 | Ring structures in device die | Ying-Ju Chen, Hsien-Wei Chen | 2019-04-16 |
| 10204883 | Semiconductor device and manufacturing method thereof | Hsien-Wei Chen | 2019-02-12 |
| 10204863 | Semiconductor package structure | Hsien-Wei Chen | 2019-02-12 |
| 10187654 | Method and device for forward multiple-hypothesis encoding/decoding of image block | Lu Yu, Yong Ling, Zhenjiang Shao, Xingguo Zhu | 2019-01-22 |