Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475786 | Packaged semiconductor device | Yiqi Tang, Makarand Ramkrishna Kulkarni | 2019-11-12 |
| 10262957 | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels | Minhong Mi, Gary P. Morrison, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield +2 more | 2019-04-16 |