Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461009 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2019-10-29 |
| 10446520 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Shang-Yun Hou, Kim Hong Chen, Wensen Hung | 2019-10-15 |
| 10332823 | Packaged semiconductor devices | Kim Hong Chen, Shin-Puu Jeng, Wensen Hung | 2019-06-25 |