Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461009 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2019-10-29 |
| 10340242 | Semiconductor device and method of manufacturing the same | Kuan-Yu Huang, Tzu-Kai Lan, Shou-Chih Yin, Shu-Chia Hsu, Pai Yuan Li +2 more | 2019-07-02 |