Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515869 | Semiconductor package structure having a multi-thermal interface material structure | Ting-Yu Yeh, Chia-Hao Hsu, Kuo-Chiang Ting, Tu-Hao Yu, Shang-Yun Hou | 2019-12-24 |
| 10515906 | Forming large chips through stitching | Wen-Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou | 2019-12-24 |
| 10510722 | Semiconductor device and method for manufacturing the same | Tu-Hao Yu, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu | 2019-12-17 |
| 10319699 | Chip package having die structures of different heights | Wen-Hsin Wei, Chi-Hsi Wu, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou | 2019-06-11 |
| 10304800 | Packaging with substrates connected by conductive bumps | Ting-Yu Yeh, Chia-Hsin Chen, Tu-Hao Yu, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2019-05-28 |