Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515869 | Semiconductor package structure having a multi-thermal interface material structure | Chia-Hao Hsu, Weiming Chris Chen, Kuo-Chiang Ting, Tu-Hao Yu, Shang-Yun Hou | 2019-12-24 |
| 10304800 | Packaging with substrates connected by conductive bumps | Weiming Chris Chen, Chia-Hsin Chen, Tu-Hao Yu, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2019-05-28 |