Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515869 | Semiconductor package structure having a multi-thermal interface material structure | Ting-Yu Yeh, Chia-Hao Hsu, Weiming Chris Chen, Kuo-Chiang Ting, Shang-Yun Hou | 2019-12-24 |
| 10515888 | Semiconductor device and method for manufacturing the same | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2019-12-24 |
| 10510722 | Semiconductor device and method for manufacturing the same | Weiming Chris Chen, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu | 2019-12-17 |
| 10304800 | Packaging with substrates connected by conductive bumps | Weiming Chris Chen, Ting-Yu Yeh, Chia-Hsin Chen, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2019-05-28 |
| 10170457 | COWOS structures and method of forming the same | Wei-Ming Chen, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu | 2019-01-01 |