Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515906 | Forming large chips through stitching | Hsien-Pin Hu, Shang-Yun Hou, Weiming Chris Chen | 2019-12-24 |
| 10319699 | Chip package having die structures of different heights | Chi-Hsi Wu, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Weiming Chris Chen | 2019-06-11 |