Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510654 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh +1 more | 2019-12-17 |
| 10504751 | Package structures and method of forming the same | Hsien-Wei Chen, Cheng-Hsien Hsieh, Lai Wei Chih | 2019-12-10 |
| 10475768 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2019-11-12 |
| 10398224 | Connector for modular rack assembly | — | 2019-09-03 |
| 10319681 | Dummy features in redistribution layers (RDLS) and methods of forming same | Cheng-Hsien Hsieh, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2019-06-11 |
| 10290584 | Conductive vias in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2019-05-14 |
| D843792 | Pan rack | — | 2019-03-26 |
| D840728 | Utility rack | — | 2019-02-19 |