Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504751 | Package structures and method of forming the same | Hsien-Wei Chen, Cheng-Hsien Hsieh, Li-Han Hsu | 2019-12-10 |
| 10276401 | 3D shielding case and methods for forming the same | Monsen Liu, Chuei-Tang Wang, Chen-Hua Yu | 2019-04-30 |
| 10270172 | Embedding low-k materials in antennas | Monsen Liu, Chung-Hao Tsai, Jeng-Shien Hsieh, En-Hsiang Yeh, Chuei-Tang Wang | 2019-04-23 |