WW

Wei-Cheng Wu

TSMC: 34 patents #11 of 3,065Top 1%
PI Pro-Iroda Industries: 3 patents #1 of 4Top 25%
📍 Hsinchu, DE: #1 of 2 inventorsTop 50%
Overall (2019): #547 of 560,194Top 1%
37
Patents 2019

Issued Patents 2019

Showing 26–37 of 37 patents

Patent #TitleCo-InventorsDate
10332882 Semiconductor device having protective structure over shallow trench isolation region and fabricating method thereof Harry-Hak-Lay Chuang 2019-06-25
10325919 Mask design for embedded memory Li-Feng Teng 2019-06-18
10325918 Semiconductor device and manufacturing method thereof Li-Feng Teng 2019-06-18
10319683 Multi-stacked package-on-package structures Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh 2019-06-11
10319681 Dummy features in redistribution layers (RDLS) and methods of forming same Cheng-Hsien Hsieh, Li-Han Hsu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more 2019-06-11
10290584 Conductive vias in semiconductor packages and methods of forming same Cheng-Hsien Hsieh, Li-Han Hsu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more 2019-05-14
10283512 Semiconductor device and manufacturing method thereof Li-Feng Teng 2019-05-07
10276587 NVM memory HKMG integration technology Chien-Hung Chang 2019-04-30
10276588 HKMG high voltage CMOS for embedded non-volatile memory Harry-Hak-Lay Chuang, Ya-Chen Kao, Yi Hsien Lu 2019-04-30
10269738 Semiconductor device and method of manufacture Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Tsung-Shu Lin 2019-04-23
10176864 Static random access memory circuits Wei Min Chan, Yen-Huei Chen, Hung-Jen Liao, Ping-Wei Wang 2019-01-08
10175294 Testing of semiconductor chips with microbumps Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu, Chao-Hsiang Yang 2019-01-08