Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483174 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Hsien-Wei Chen, Ming-Fa Chen | 2019-11-19 |
| 10175294 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu | 2019-01-08 |