Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510650 | Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate vias | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2019-12-17 |
| 10510691 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2019-12-17 |
| 10483174 | Integrated circuit component and package structure having the same | Chao-Hsiang Yang, Hsien-Wei Chen, Ming-Fa Chen | 2019-11-19 |
| 10468379 | 3DIC structure and method of manufacturing the same | Hsien-Wei Chen, Jiun-Heng Wang, Ming-Fa Chen | 2019-11-05 |
| 10262939 | Configurable routing for packaging applications | Chung-Yu Lu, Hsien-Pin Hu, Shin-Puu Jeng, Shang-Yun Hou, Shih-Wen Huang +1 more | 2019-04-16 |