Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510650 | Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate vias | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2019-12-17 |
| 10510718 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Wen-Chih Chiou | 2019-12-17 |
| 10475762 | 3DIC structure and method of manufacturing the same | Hsien-Wei Chen, Ming-Fa Chen | 2019-11-12 |
| 10381298 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen | 2019-08-13 |
| 10319707 | Semiconductor component, package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Chi-Hwang Tai | 2019-06-11 |
| 10290571 | Packages with si-substrate-free interposer and method forming same | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen | 2019-05-14 |