Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE47709 | Forming grounded through-silicon vias in a semiconductor substrate | Wei-Cheng Wu, Hsiao-Tsung Yen, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2019-11-05 |
CH
Chi-Chun Hsieh
Overall (2019): #513,424 of 560,194Top 95%
1
Patents 2019