Issued Patents 2019
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510476 | Slow wave inductive structure and method of forming the same | Cheng-Wei Luo | 2019-12-17 |
| 10504853 | Electronic device capable of suppressing electromagnetic radiation and manufacturing method thereof | Yuh-Sheng Jean, Ta-Hsun Yeh | 2019-12-10 |
| 10497507 | Semiconductor element | Cheng-Wei Luo, Yuh-Sheng Jean, Ta-Hsun Yeh | 2019-12-03 |
| RE47709 | Forming grounded through-silicon vias in a semiconductor substrate | Chi-Chun Hsieh, Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2019-11-05 |
| 10446516 | Semiconductor package structure | Ping-Yuan Deng, Yuh-Sheng Jean, Ta-Hsun Yeh | 2019-10-15 |
| 10373954 | FinFET and manufacturing method of the same | Ta-Hsun Yeh, Cheng-Wei Luo, Yuh-Sheng Jean | 2019-08-06 |
| 10340193 | Fin field effect transistor and manufacturing method thereof | Ta-Hsun Yeh, Cheng-Wei Luo, Yuh-Sheng Jean | 2019-07-02 |
| 10340880 | Structures of planar transformer and balanced-to-unbalanced transformer | — | 2019-07-02 |
| 10312190 | Structure of integrated inductor | Kai-Yi Huang | 2019-06-04 |
| 10276295 | Compact vertical inductors extending in vertical planes | Huan-Neng Chen, Yu-Ling Lin, Chin-Wei Kuo, Mei-Show Chen, Ho-Hsiang Chen +1 more | 2019-04-30 |
| 10269733 | Integrated circuit device | Yuh-Sheng Jean, Ta-Hsun Yeh | 2019-04-23 |
| 10269746 | Methods and apparatus for transmission lines in packages | Chin-Wei Kuo, Min-Chie Jeng, Yu-Ling Lin | 2019-04-23 |
| 10262782 | Integrated inductor structure | Cheng-Wei Luo, Yuh-Sheng Jean, Ta-Hsun Yeh | 2019-04-16 |
| 10249581 | Transmission line for 3D integrated circuit | — | 2019-04-02 |
| 10210981 | Integrated inductor structure | Cheng-Wei Luo, Yuh-Sheng Jean, Ta-Hsun Yeh | 2019-02-19 |
| 10186364 | Electronic device with two planar inductors | Kai-Yi Huang, Yuh-Sheng Jean, Ta-Hsun Yeh | 2019-01-22 |